Термо паста Thermaltake TG-50 4G

Предназначен за	Охлаждащи системи
Х-ка 2	TG-50 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
Х-ка 3	With a thermal conductivity of 8.0 W/m-k, the thermal compound also contains diamonds powder allowing users to pursue a higher heat transfer rate.
Х-ка 4	Density: 2.9 g/cm3
Х-ка 5	Viscosity: 47 Pa-s
Х-ка 6	Thermal impedance: 0.035°C -in2/W
Х-ка 7	Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
Х-ка 8	This thermal compound application kit includes a set of easily-applied tools for immediate use.