Термо паста Thermaltake TG-30 4G

Предназначен за	Охлаждащи системи
Х-ка 2	TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
Х-ка 3	The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
Х-ка 4	Density: 2.55 g/cm3
Х-ка 5	Viscosity: 76 Pa-s
Х-ка 6	Thermal impedance: 0.185°C -in2/W
Х-ка 7	Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
Х-ка 8	The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use. Non-electrical conductive compound ensures better safety measures for you and your system.